While there are no direct local distributors listed for Kenya, companies typically source these machines through international secondary markets. Datacon 2200 evo advanced - Product details | Besi
: Owners of machines manufactured after 2020 can access manuals, 2D/3D images, and technical documents via the Besi Webshop Customer Area . datacon 2200 evo manual pdf kenya
Understanding the machine's capabilities is vital for optimizing production lines in Kenya: Specification Details @ 3s (model dependent) Bond Force Programmable from 0.5N up to 500N (on the hF model) Throughput Up to 12,000 Units Per Hour (UPH) for the EVO hS model Wafer Sizes Handles 4" to 12" wafers (SEMI M1) Die Size Range 0.15 mm to 50 mm Dimensions 1,160 mm x 1,225 mm x 1,750 mm; Weight: ~1,300 kg Machine Highlights & Capabilities While there are no direct local distributors listed
: Supports epoxy, soldering, thermo-compression, and eutectic processes. 160 mm x 1
